FIELD: measuring technology.
SUBSTANCE: invention relates to the field of measuring technology for research at low temperatures, in particular to devices with switching from a superconducting state to a normal state or vice versa, and can be used in technology for low and ultra-low temperatures. The effect is achieved in the invention as follows. The thermodynamic noise source contains a high-frequency matched load, including an absorber made in the form of a micron-sized film made of a superconducting material, which is mounted on a dielectric substrate together with a coplanar waveguide, through the electrodes of which the source is connected to an electric circuit with the possibility of eliminating the leakage of a high-frequency signal and supplying a direct current. The source is included in the measuring circuit and its output of the noise signal is connected to the input of the device under study, and the operating temperature of the dielectric substrate lies below the superconducting transition temperature of the absorber material. In addition, the measuring circuit consists of a current source, a voltmeter and a device under test in the form of a reference power meter. Also, the transmission of the source noise signal to the device under test is carried out via cable or through free space using the emitting and receiving antennas. In a particular case, the direct current setting circuit is made in the form of an integral planar structure, including a capacitor and an inductor, which are connected to two terminals of the absorber and mounted together with it on a dielectric substrate. Also, in a particular case, the direct current setting circuit is made in the form of a direct current injector connected between the load and the reference power meter.
EFFECT: significant decrease in the thermal power applied to the source during measurements, an increase in the performance of the device in the research process, as well as to the simplification of the equipment used in the measurements.
5 cl, 6 dwg
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Authors
Dates
2021-10-21—Published
2021-04-20—Filed