METHOD FOR MANUFACTURING STRUCTURES ON SUBSTRATES USING WET DEPOSITION Russian patent published in 2021 - IPC C23C28/00 C23C14/22 C23C16/44 H01L21/208 

FIELD: electricity.

SUBSTANCE: invention relates to a method for manufacturing a structural coating on a substrate for the purpose of protecting the substrate from short circuiting. A first dielectric layer is deposited on the substrate by means of wet deposition. A first conductive layer is deposited on the first dielectric layer. A second dielectric layer is deposited thereon by means of wet deposition, and a second electrically conductive layer is deposited thereon. A dielectric intermediate layer is deposited between the first dielectric layer and the second electrically conductive layer using the technological process of dry deposition.

EFFECT: possibility of using wet deposition without short circuiting occurring between the electrically conductive layers is provided to achieve the acceptable yield and security even if relatively large particles or non-homogeneity are present on the substrate.

11 cl, 4 dwg, 1 ex