FIELD: metal coatings chemical deposition.
SUBSTANCE: invention relates to the chemical deposition of metal coatings and can be used in various branches of mechanical engineering and instrument making. The solution for chemical nickel plating of metal products contains the following components, g/l: organic nickel salt (according to Ni) 3-10; reducing agent 20-35; ligand 20-40; buffering additive 20-40, di- (n-propyl) phosphonic acid 5-15; oxyphenylaminopyridine 0.001-0.005; water - up to 1 liter. As an organic salt of nickel, the solution contains acetate, or propionate, or nickel lactate. As a reducing agent, it contains hypophosphorous acid ethyl ester or hypochlorous acid pentochlorophenyl ester.
EFFECT: increased stability of the solution for chemical nickel plating, intensification of the deposition process at low temperatures and improvement of the decorative properties of the coating by reducing the degree of roughness.
5 cl, 13 ex
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