FIELD: metallurgy.
SUBSTANCE: invention relates to electrochemical deposition of tin-indium alloy from sulfate electrolyte and can be used in production of copper wire coated with tin-indium alloy. The method includes electrodeposition of a coating in an electrolyte containing, g/l: tin sulfate in terms of metal 17-35, indium sulfate in terms of metal 20-45, sulfuric acid 80-120, 3.5-(isophoronebis[N,N- dipropyltriethoxysilyl]urea 0.1-1, isopropyl alcohol 10-20 ml/l, propylene glycol 15-20 ml/l. by current 87-96% and obtaining a coating of an alloy of tin-indium, the content of indium in which is 41-51.0 wt.%.
EFFECT: increase in the affinity of the copper wire with the alloy at the microcrystalline level and the adhesion strength of the adhesion of the coating to the copper base, the ability to control the thickness of the coating, its physical and mechanical properties.
1 cl, 1 dwg, 1 tbl
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Authors
Dates
2022-03-24—Published
2021-06-30—Filed