FIELD: working of metal.
SUBSTANCE: invention relates to a method for treating the surface of a non-ferrous metal by forming a microrelief and can be applicable in various sectors of metallurgical science and metal working. The selected surface area with a surface purity Rz of no more than 1 mcm is mechanically treated, and then treated by laser irradiation. Irradiation is executed at the laser wavelength of the used laser source at an energy density in a pulse of 0.1 to 1 J/cm2 along a scanning trajectory providing at least a 95% overlap of the laser beam spots. Each treatment area is irradiated with a series of several dozen laser pulses with a duration of 10-12 to 3·10-8 s, providing appearance of a regular microrelief on the near-surface layer of copper or an alloy thereof without melting. After a regular microrelief appears on the near-surface layer of copper or an alloy thereof, the laser beam spot is moved along the area, and the laser treatment is repeated.
EFFECT: provided possibility of identifying the grain boundary structure and producing a regular microrelief of the surface of copper or an alloy thereof without noticeable crater formation on the surface, deteriorating the surface quality.
12 cl, 2 dwg
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Authors
Dates
2022-01-21—Published
2021-01-26—Filed