METHOD FOR MANUFACTURING THE STRUCTURE OF AN OPTOELECTRONIC BUS OF A PRINTED CIRCUIT BOARD AND APPARATUS FOR IMPLEMENTATION THEREOF Russian patent published in 2022 - IPC G02B6/10 H05K1/02 

FIELD: electronics.

SUBSTANCE: invention relates to the technology for manufacturing a printed circuit board and/or a substrate of the body of a semiconductor integrated circuit, in particular, to a method for manufacturing the structure of a high-density optical waveguide and to the printed circuit board itself. Claimed method for manufacturing the structure of an optoelectronic bus on the surface of a printed circuit board consists in manufacturing a master die of the structure of optical waveguides of an optoelectronic bus, applying a polymer material of the of optical waveguides, applying a polymer material of the lower shell of optical waveguides, and applying a polymer material of the upper shell of optical waveguides. The method of photolithography is therein used in order to produce the master die, consecutively applying the two layers thereof and forming a two-layer structure of the master die from a single material, then applying a layer of an adhesion modifier to the formed master die structure. The polymer material of the core of optical waveguides is then applied to the master die by pouring, followed by broaching with a scraper over the master die, the polymer material of the lower shell is applied, followed by broaching with a scraper over a frame of a set thickness, and the polymer material of the lower shell is covered with the base of the printed circuit board with a preactivated contact surface and held until the polymer materials are fully cured. The base, being a printed circuit board with the formed layers of the lower shell and the core of optical waveguides, is then removed from the master die, followed by applying the polymer material of the upper shell and subsequently broaching over a frame of a set thickness. The apparatus of an optoelectronic bus of a printed circuit board comprises a base of a printed circuit board with the above structures of polymer planar optical waveguides of the optoelectronic bus applied thereon. The cross section of cores of the polymer planar optical waveguides is therein rectangular with the dimensions of the rectangle within 10…100 mcm×10…100 mcm. The core, the lower and upper shells of the polymer planar optical waveguides are made of the same polymer material, but with different refractive indices, and the lower and upper shells of the polymer planar optical waveguides are made with a thickness in the range of 10…60 mcm.

EFFECT: increase in the quality of polymer planar optical waveguides of the optoelectronic bus of a printed circuit board and reduction in losses occurring during optical signal transmission.

2 cl, 6 dwg