FIELD: nanotechnology.
SUBSTANCE: invention relates to the field of nanotechnology and thermometry and can be used to measure ultra-local temperature fields with nano-resolution in biomedicine, biotechnology, and microelectronics. The claimed method for ultra-local optical temperature measurement is based on excitation of the luminescence of the impurity centers of a diamond particle, registration of the luminescence spectrum of a diamond particle, preliminary calibration of a diamond particle depending on the temperature and position of the maximum of the phononless luminescence line of a diamond particle, determination of temperature in the medium under study using pre-calibration data, while selecting a diamond particle of nanometer size, placing a diamond particle at the end of the nanodiamond probe, which is installed in a micromanipulator, with the help of which a nanodiamond probe is precisely placed at a given point of the medium under study to determine its temperature. An ultra-local optical temperature measurement device for implementing the method includes a diamond particle, a laser radiation unit for exciting the luminescence of the impurity centers of a diamond particle and a luminescence registration unit, while a micromanipulator made with the possibility of reciprocating movement and a nanodiamond probe with a pre-calibrated nanometer-sized diamond particle installed at the end of the nanodiamond probe are introduced into it, moreover, the nanodiamond probe is installed in a micromanipulator and is made with the possibility of precision placement in the medium under study. The nanodiamond probe for use in the device contains a glass capillary, in the end of which there is a pre-calibrated active particle containing at least one impurity center.
EFFECT: claimed method, device and nanodiamond probe of the device can be widely used as a precision device that provides accurate control of heat flows and temperature measurement in nanoscopic volumes of living cells, as well as in microelectronics when measuring the thermal conductivity of integrated circuit elements.
17 cl, 6 dwg
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Authors
Dates
2022-10-11—Published
2021-12-27—Filed