FIELD: electroplating.
SUBSTANCE: invention relates to the field of electroplating and can be used to obtain superhydrophobic coatings with high protective and functional properties, providing an effective reduction in the rate of corrosion processes during the operation of structures and structures made of copper or having a copper coating. The method consists in electrochemical deposition of a copper composite at a temperature of 18-25 °C and a current density of 0.1-45 A/dm2 from an electrolyte composition, g/l: CuSO4×5H2O 180-220, H2SO4 40-60, containing 1-60 g/l of nanosized particles and 0-15 g/l of surface-active substances (surfactants), followed by the application of a layer of water repellent on the resulting surface.
EFFECT: increase in the strength of the superhydrophobic coating obtained by the electrochemical method based on the heat- and electrically conductive copper matrix.
5 cl, 5 ex
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Authors
Dates
2022-12-19—Published
2022-07-25—Filed