DEVICE FOR MONITORING AND CONTROLLING TECHNOLOGICAL PROCESS OF DEPOSITION OF CONDUCTIVE THIN FILMS Russian patent published in 2023 - IPC C23C14/54 G01B7/02 G01N27/02 

FIELD: film deposition.

SUBSTANCE: invention is related to a device for monitoring and controlling the process of deposition of a conductive thin film. Said device includes a vacuum chamber, an evaporator of the sprayed substance, an electromechanical damper, a block of five wire resistive witnesses and a power supply unit for heating said wire resistive witnesses to the temperature of evaporation of the sprayed substance from their surface, configured to be connected to the specified resistive wire sensors after the deposition process is completed. Said electromechanical damper consists of a central round element and three rings, which provide overlapping of the molecular flow from the evaporator to the areas of the substrate surface, where the said molecular flow has the maximum density. Said overlapping of the molecular flow is carried out when each connected resistive wire sensor reaches the resistance specified in the control program, corresponding to the required thickness of the deposited conductive thin film. The servomotors of the central round element and three rings of the electromechanical damper are connected to a microprocessor device, to which the evaporator power control unit and the motor speed control unit, which ensures the rotation of the substrate, are connected.

EFFECT: obtaining a film of a given and uniform thickness over the entire surface of the substrate.

1 cl, 7 dwg