DEVICE WITH PROGRAMMED NUMERICAL CONTROL FOR APPLICATION OF THICKNESS-SPECIFIED LAYERS OF MATERIALS ON SURFACE OF SUBSTRATES Russian patent published in 2025 - IPC H01L21/203 

FIELD: semiconductor microelectronics equipment.

SUBSTANCE: numerically controlled device for forming sublimated layers of a given thickness on substrates includes a vacuum chamber accommodating a substrate, a gate and a resistive source, wherein the vacuum chamber also houses a quartz sensor and a pressure sensor, wherein the quartz sensor is connected to the input of a thickness gauge, the output of which is connected to the input of the microcontroller, the pressure sensor is connected to the input of the microcontroller, the resistive source is connected to a first ammeter connected to the input of the microcontroller and to a first power controller, which input is connected to the microcontroller output, the flap is connected to the solenoid, which input is connected to the solenoid control device, the solenoid control device input is connected to the microcontroller output, substrate is connected to a second ammeter connected to a second power controller, the output of the second ammeter is connected to the input of the microcontroller, and the input of the second power controller is connected to the output of the microcontroller, the power controllers and the solenoid control device are connected to five corresponding power supplies, wherein the microcontroller is connected to a personal computer.

EFFECT: invention provides the ability to apply materials: semiconductor films, alloying additives, to form metal contacts, while at all stages of applying materials, automated adjustment of the sublimation rate from the resistive evaporator is carried out taking into account the current pressure parameters in the vacuum chamber.

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