FIELD: electronic engineering.
SUBSTANCE: invention is intended for mounting electronic components of devices, in particular microcircuits with a matrix arrangement of contact pads on the base of the housing on a printed circuit board. The effect is achieved in that the device for mounting microcircuits on a printed circuit board includes a contact panel, a cover and mounting screws in the holes of the contact panel that coincide with the contact pads on the chip body and the contact pads on the printed circuit board and is made of electrical insulating material. Spring contact elements made of twisted wire, exceeding the height of the hole, are also installed with a gap; a rectangular protrusion is made along the perimeter of the contact panel on the side where the microcircuit is installed, corresponding to the height of the microcircuit body; a spring strip is installed on the contact panel along the inner perimeter of the rectangular protrusion adjacent to its wall, in which petals are made protruding above the plane of the tape, and the ends of the petals are facing the base of the rectangular protrusion. In the protrusion along the perimeter and, accordingly, in the cover along the perimeter there are holes for mounting screws, while a pair of screws located diagonally are installed in the holes of the cover with a gap, and in the holes of the contact panel and in the holes of the printed circuit board - according to the fit, and the rest with a gap, and the screws are tightened with nuts and washers on the back side of the printed circuit board, while the cover rests on the microcircuit body around the perimeter.
EFFECT: simplified design and expanded functionality - solderless installation of microcircuits with a matrix arrangement of contact pads on the base of the housing on printed circuit boards with a high-density layout while maintaining the reliability of the connections.
1 cl, 5 dwg
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Authors
Dates
2024-02-07—Published
2022-12-16—Filed