FIELD: semiconductor electronics.
SUBSTANCE: used when applying galvanic coatings to the housings of semiconductor devices. The method includes chemical or galvanic deposition of nickel, galvanic deposition of gold, final rinsing in distilled or deionized water and drying; after rinsing and drying, the housings are sharply heated for 3-6 seconds to a temperature of 300-350 °C, and after cooling the cases, additional final rinsing and drying is carried out.
EFFECT: removal of electrolyte and salts hidden in microcavities from the surface of the coating, which can lead to corrosion of the metal pads of the crystal, aluminium mounting conductors, etc., of a mounted device in a gold-plated housing.
1 cl, 2 tbl, 1 dwg
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Authors
Dates
2024-03-18—Published
2023-08-23—Filed