SEMICONDUCTOR CHIP MANUFACTURING PROCESS Russian patent published in 1994 - IPC

FIELD: semiconductor engineering. SUBSTANCE: resistive-contact metal layer is applied to surface of semiconductor strip with shaped structures of semiconductor devices. Photoresist mask is formed on this layer along dividing tracks. Mechanical shielding layer is applied to vacant sections. Photoresist mask is removed. Strip is chemically separated into chips. Side surfaces formed in the process are covered with protective polymeric compound, shielding metal is chemically removed. Base metals of groups IY-YIII or their alloys are used as resistive- contact metals. EFFECT: facilitated procedure. 3 cl, 1 tbl