METHOD OF COOLING ELECTRONIC COMPONENTS OF PRINTED CIRCUIT BOARDS Russian patent published in 2016 - IPC H05K7/20 G06F1/20 

FIELD: cooling; electronic equipment.

SUBSTANCE: installed on a board is a heat-removing module with provision of thermal contact of its surface with electronic components of the board; the heat-removing module is made in the form of a tight shell of elastic heat-conducting material, the volume of which is filled with a dosed amount of heat-conducting substance; inside the shell there is installed a heat exchanger through which cooling liquid is supplied. At that, the elements of the heat exchanger are installed above the heat-producing surfaces of boards' components, while outputs of the heat exchanger are arranged outside the closed volume of the shell.

EFFECT: development of a universal method of cooling of electronic components of printed circuit boards with increased efficiency of cooling due to the use of a wide range of substances, having sufficient thermal conductivity, plasticity within the operating temperature range of the cooled electronics, as well as plasticity of the heat-conducting shell material, which ensures good thermal contact with components of the board.

1 cl, 2 dwg