MICROCHANNEL WITH COMBINED COATINGS FOR COOLING ELECTRONIC COMPONENTS Russian patent published in 2025 - IPC H01L23/473 F28C3/08 B82Y40/00 

FIELD: heat power engineering.

SUBSTANCE: invention relates to heat engineering and can be used for cooling components of electronic equipment, in particular radioelectronic systems, microcircuits, processors, in cramped conditions, in aircraft or cars. According to the invention, the microchannel is horizontally located slot (1), on the lower solid wall of which hydrophilic coating (2) is formed, and on the upper wall there is superhydrophobic coating (3). Hydrophilic coating (2) on the lower wall of the microchannel is a layer of silicon carbide nanoparticles and their agglomerates with size from 50 to 250 nm, which form a porous structure with a combination of small and large pores. Superhydrophobic coating (3) on the upper wall of the microchannel is made by creating in the wall of cavities with fine solid particles with size from 40 to 120 mcm with nanorelief.

EFFECT: invention makes it possible to increase reliability of cooling of heat-loaded devices in conditions of limited space, at the same time there is an increase in critical heat load during boiling in microchannel.

1 cl, 3 dwg