FIELD: heat engineering.
SUBSTANCE: invention relates to heat engineering and can be used in electronic equipment cooling systems. The two-phase, hybrid, single-component electronic equipment cooling system includes a flat mini- or microchannel with a rectangular cross-section, one of the walls whereof (lower wall) is the substrate of the electronic heat-generating component located thereon. According to the invention, one or several nozzles with a constant rectangular cross-section are made in the upper wall of the flat mini- or microchannel, arranged in a row or several rows, wherein the nozzles are made at an angle from 10 to 90 degrees to the direction of movement of the boiling liquid flow pumped along the mini- or microchannel, wherein microjets are supplied into the end part of the channel.
EFFECT: invention increases efficiency of cooling highly heat-flow stressed electronic components.
2 cl, 1 dwg
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