FIELD: heat engineering.
SUBSTANCE: invention relates to heat engineering and can be used in cooling systems of electronic equipment. In a device for intensifying heat exchange, comprising a flat mini- or microchannel of rectangular cross-section, one of the walls of which is a substrate for electronic heat-dissipating elements located on it, and cooling takes place due to evaporation of thin film of liquid entrained by flow of steam, gas or steam-gas mixture, surface of fuel elements is covered with micro-caverns of cylindrical shape with diameter of 30–50 mcm and depth of 200–300 mcm, located from each other at distance in range of 300–800 mcm, wherein the surface of the heat-dissipating elements, which is not occupied by micro-caverns, is coated with a non-wettable micro- or nanocoating, wherein advancing and receding contact wetting angle ranges from 80 to 140 degrees.
EFFECT: increasing the cooling efficiency of electronic components with high thermal stress.
1 cl, 4 dwg
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Authors
Dates
2024-06-26—Published
2023-12-14—Filed