METHOD FOR COOLING ELECTRONIC EQUIPMENT Russian patent published in 2021 - IPC H01L23/473 H05K7/20 

FIELD: heat engineering.

SUBSTANCE: invention relates to heat engineering; it can be used in systems for cooling electronic equipment. A method for cooling electronic equipment is proposed based on the movement of micro-streams under the action of gas flow along a channel on the surface of substrate forming the lower wall of the channel with one or several electronic heat-generating elements due to periodic longitudinal micro-grooves or strips of hydrophobic nano-coating. In the case of slight heat release on the electronic component, only gas is supplied to the channel. If the thermal load increases, then additional liquid is fed into the channel and micro-streams of liquid are formed. In the case of an even greater increase in heat generation on the electronic component, liquid is additionally fed into micro-nozzles that are located along micro-grooves or strips of hydrophobic nano-coating.

EFFECT: an increase in the cooling efficiency of high-voltage electronic components with heat flows due to the use of combined micro-stream and drip liquid flows.

1 cl, 3 dwg