MULTI-CHIP MICROCIRCUIT Russian patent published in 2018 - IPC H01L23/52 H01L25/18 

FIELD: electrical engineering.

SUBSTANCE: invention refers to the field of microelectronics. Multi-chip microcircuit comprising the stack of chips of the same size, which have the conductive areas that extend to the front face of the foot and are connected to the contact areas of the chips, the base board, which is connected to the stack of chips and has the necessary interconnection wiring and external terminals located on the underside of the base board for mounting the multi-chip microcircuit onto the printed circuit board, while on the upper side of the base plate, miniature conductive points are formed, the locations of which correspond to the conducting regions on one face of the stack of chips, and are electrically connected therewith.

EFFECT: invention provides for the reduction in the size of the multi-chip microcircuit and for the increase in its reliability.

1 cl, 4 dwg