SURFACE-WIRING THIN-FILM RESISTOR INTEGRATED CIRCUIT Russian patent published in 1997 - IPC

Abstract RU 2079210 C1

FIELD: electronic engineering. SUBSTANCE: integrated circuit has insulating substrate and thin-film resistor structure formed on it and built up of one or more resistors covered with material protecting them from mechanical and environmental effects; terminal leads are made in the form of metal strips fixed by soldering or welding to resistor strip and located on one side of insulating substrate so that they occupy its entire width and are brought out beyond integrated circuit towards side from their points of connection to thin-film resistors. EFFECT: improved design. 2 dwg

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RU 2 079 210 C1

Authors

Lugin A.N.

Vlasov G.S.

Dates

1997-05-10—Published

1995-03-06—Filed