FIELD: microelectronics. SUBSTANCE: field oxide is created on monocrystal substrate with the aid of process of local oxidation of silicon. Then undergate oxide and polysilicon gate are manufactured. Oxidation of gate is carried out. Then oxide over entire surface of structure is etched. With this areas of source and drain are open and oxide on polysilicon gate is kept. Using produced mask ion doping of areas of source and drain is conducted. Finally standard stages of manufacture of MIS transistor are performed. EFFECT: simplified manufacturing process, increased speed of response of MIS transistors and improved degree of integration of MIS large integrated circuits on their base. 4 dwg
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Authors
Dates
1994-02-28—Published
1986-01-02—Filed