FIELD: semiconductor technology. SUBSTANCE: method involves generation of source, drain and gate dielectric areas on silicon plate, application of metal tracks and adjustment of threshold voltage by affecting plates with built structures by X-ray radiation which value is proportional to adjustment value ΔU.. This is achieved by measuring geometric distribution of threshold voltages of transistors over plate and detection of n+1 areas where threshold voltage conforms to equation [Uo+(n-1/2)ΔUo]-[Uo+(n-1/2)ΔUo], where n is natural number, ΔUo is possible range of threshold voltage for good transistors. Later on, selected zones of plate are affected by X-ray radiation by doses which correspond to average value of deviation of threshold voltage n·ΔUo in each zone. EFFECT: increased good-to-bad ratio. 1 dwg
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Authors
Dates
1995-05-27—Published
1986-12-10—Filed