METHOD OF SOLDERING DIFFERENT-THICKNESS MEMBER STRUCTURES Russian patent published in 1997 - IPC

FIELD: mechanical engineering; soldering of multiple-member structures manufactured of aluminium or other metals, for instance, plate-and-fin heat exchangers. SUBSTANCE: when soldering structures of different thickness members solder is applied to surfaces to be connected to form metallic bond between solder and surface. Solder with wide interval of crystallization is applied to thick-walled members, and solder with narrow interval of crystallization is applied to thin-walled members. Structure is assembled and uniformly heated to temperature at which solder on thick-walled members of structure is at solid-liquid state and on thin-walled members melts completely. Similar or different-base solders are applied to thick-walled and thin-walled members. EFFECT: increase service life of structure assembled of different thickness members owing to improvement of quality of soldered joints, reduced labour input. 3 cl, 1 tbl