FIELD: metallurgy.
SUBSTANCE: invention can be used in high-temperature soldering of aluminium and its alloys, for example of flat termo-boards. Assembly of parts for soldering is performed through metal spacer with ultimate strength, larger or equal to ultimate strength of soldered parts. Layer of solder is applied on both sides of the spacer. Thickness of metal spacer with solder ranges from 0.3 to 0.8 mm. Ratio of spacer thickness to layer of solder applied on one side equals from 8:1 to 10:1. Components are soldered and cooled.
EFFECT: method provides elimination of dry joints due to uniform distribution of solder on soldered surfaces.
1 cl, 1 ex
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