ELECTRONIC DEVICE SEALING METHOD Russian patent published in 1994 - IPC

FIELD: radio electronics. SUBSTANCE: surfaces on butt ends of cover are mechanically ground until microridges, up to 5000 cm²/g microns deep, appear; paste layers are applied by stenciling method; paste is composed of grass powder C65-1 having specific surface area of 5000 sq. m/g and organic binder, which is effect in muffle furnace at 560 ± 10^°С for 1.5 h to allow organic binder to burn out and glass powder to fuse until low-melting glass layer. 10 to 20 microns thick, is formed. Cavity components are placed in separator and installed in vacuum chamber, heated to 530 ± 10^°С, and compression pressure of 1,5 ± 0,5 MPa is applied for 15 min. EFFECT: simplified sealing procedure, reduced expanses required, twice as low prime cost of crystal cavities.