CHIP PACKAGE Russian patent published in 1994 - IPC

FIELD: microelectronics. SUBSTANCE: chip package includes ceramic board 1 having bonding site 2 and lead frame 3 having external 4 and internal lead parts connected to bonding site 2. Ceramic board 1 is pyramidal and has lateral faces made as steps of equal height, on which are disposed bonding sites 2. Bonding sites 2 form symmetrical groups consisting of central site 7, which is disposed on upper step 8, and of mirror symmetrical sites 9 disposed on lower steps 10 of board 1. The design enables to make chip packages with 132 connectors or more having pitch 0.625 mm or less. EFFECT: improved design; improved technological effectiveness. 2 dwg