FIELD: microelectronics. SUBSTANCE: invention is related to development and manufacture of equipment based on microelectronic articles and semiconductor devices, it can be used to test and reject crystals of integrated circuits before their mounting in cases or multicrystal modules, for assembly of crystals in cases or in composition of multicrystal modules. Carrier of crystal has base of dielectric material with system of oriented and fixed current-carrying tracks in its surface and contacts. Some contacts are meant for connection to opposite contact pads of crystal and others are intended for connection with opposite contacts of commutation plate. They are manufactured in the form of metallized holes whose upper edges are coupled to current-carrying tracks in upper surface of carrier base. Lower edges of holes, in joints with opposite contact pads of crystal or opposite contacts of commutation plate filled with current-conducting binding material form contact nodes which provide together with current-carrying tracks for electric coupling of contacts pads with contacts of commutation plate. EFFECT: improved possibility of test of caseless crystals of integrated circuits, provision for full test of crystal through lead-out contacts of carrier. 8 cl, 3 dwg
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Authors
Dates
1999-08-10—Published
1998-12-08—Filed