MICROWAVE INTEGRATED CIRCUIT HOUSING Russian patent published in 2019 - IPC H01L23/55 

FIELD: electrical engineering.

SUBSTANCE: invention relates to electronic engineering and can be used in production of high-reliability hybrid microwave integrated circuits sealed by shovel-roller or laser welding. Technical result is provided by microwave circuit of integrated circuit, consisting of ceramic board, on one side of which there are external lead-out sites of metallization, a first ceramic layer with stripline metallisation lines electrically connected to the outer output pads through the metalised holes in the board and the first ceramic layer, the metal coating sites on the microcircuit chip board, second layer of ceramic, to metal coating of which metal rim is soldered for hermetic sealing of housing by metal cover, metallization, which electrically connects rim to metal coating platform on board. Rim is connected to the metal coating platform on the board by metalized holes, the number and dimensions of which are selected so that the housing own resonance is outside the operating range of the microcircuit.

EFFECT: eliminating possibility of finding the resonant frequency of the housing of the integrated circuit in its operating frequency range.

1 cl, 3 dwg, 2 tbl