INTEGRATED CIRCUIT PACKAGE Russian patent published in 2010 - IPC H01L23/02 

FIELD: physics.

SUBSTANCE: invention can be used in electronic engineering. The integrated circuit package has a base 1 with a conducting structure 2 and external leads 12 with bent ends. The external leads 12 are attached to bonding pads 14 which are mounted on the base 1 on two levels. Each pad 14 of one level lies between two pads of the other level with allowance for displacement of the axes of the pads of not more than 0.1 mm. Straight sections of the external leads 12 of each side of the base are attached to insulators 13 which are placed with a gap relative outer sides of the base and are made from ceramic tape with conducting layers.

EFFECT: reduced size of the package due to geometry of external leads and their arrangement on insulators with minimal spacing.

5 dwg