INTEGRATED CIRCUIT HOUSING Russian patent published in 2012 - IPC H01L23/04 

FIELD: physics.

SUBSTANCE: integrated circuit housing has a ceramic base on whose surface there are contact pads and a rectangular insulating multi-lead frame consisting of outer and insulating plates connected to each at the corners, with groups of planar leads being placed on said plates. Leads, having a working and a contact part, have a zigzag shape, wherein the spacing of the leads of the working part is equal to the spacing of leads of the contact part, and leads of the contact part are parallel to leads of the working part with spacing equal to the spacing of contacts of test devices.

EFFECT: design of an integrated circuit housing enables to test integrated circuits with installation thereof into standard sockets of contact devices of foreign and domestic standard equipment.

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