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(19)

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703 996

(13)

(51)

IPC

(21) (22)

Application

2594389/27, 1978-03-28

(22)

Actual filing date

1978-03-28

(45)

Published

1997-08-20

(72)

Inventor

Shirokova E.P.Chulkov E.I.Pekin Ju.I.Tikhomirov A.E.Rumjantsev S.G.Suvorova G.S.Tveritina S.I.Chelyshev V.B.Degtjarev I.Ja.

BINDING AGENT FOR SOLDERING PASTE Russian patent published in 1997 - IPC

Abstract SU 703996 A1

FIELD: soldering materials. SUBSTANCE: binding agent for soldering paste containing water, organic solvent, polymerized methacrylic acid ester has additionally lanolin at the following ratio of components, weight %: organic solvent taken from the group: benzene, xylene, toluene, acetone, butyl acetate 15-20; polymerized methacrylic acid ester 0.1-5; lanolin 0.1-2, and water - the rest. EFFECT: improved quality of paste.

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SU 703 996 A1

Authors

Shirokova E.P.

Chulkov E.I.

Pekin Ju.I.

Tikhomirov A.E.

Rumjantsev S.G.

Suvorova G.S.

Tveritina S.I.

Chelyshev V.B.

Degtjarev I.Ja.

Dates

1997-08-20—Published

1978-03-28—Filed