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886 388

(13)

(51)

IPC

(21) (22)

Application

2968962/27, 1980-08-07

(22)

Actual filing date

1980-08-07

(45)

Published

1997-08-20

(72)

Inventor

Leushkina T.V.Shebelova A.V.Kulikova A.E.Chulkov E.I.Pekin Ju.I.Shirokova E.P.Tikhomirov A.E.

COMPONENT COMPOSITION FOR SOLDERING PASTE Russian patent published in 1997 - IPC

Abstract SU 886388 A1

FIELD: soldering materials. SUBSTANCE: 1. Composition containing acrylic polymer and organic solvent has components at the following ratio, weight %: acrylic polymer 8-15 and organic solvent - the rest. 2. Composition according point 1. has polybutyl methacrylate as an acrylic polymer. 3. Composition according point 1. has copolymer of butyl methacrylate with butyl acrylate as an acrylic polymer at the following ratio, weight %: butyl methacrylate 75-95, butyl acrylate 5-25. 4. Composition according point 3. has additionally methyl methacrylate at amount 5-25 weight %. EFFECT: enhanced technological properties.

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SU 886 388 A1

Authors

Leushkina T.V.

Shebelova A.V.

Kulikova A.E.

Chulkov E.I.

Pekin Ju.I.

Shirokova E.P.

Tikhomirov A.E.

Dates

1997-08-20—Published

1980-08-07—Filed