FIELD: electrical engineering. SUBSTANCE: resistive layer is formed by implantation of ions of dose 1015-1017cm-2 at energy of 50-150 keV and current density of 10-3-10-2A/cm2 into ceramic substrate surface. For nitride ceramic substrate use is made of ions of lithium, or boron, or carbon, or nitrogen, or aluminium; for oxide ceramic substrate carbon ions are employed. Then substrate is annealed in nitrogen atmosphere at temperature of 1200-1500 K for nitride ceramic substrate and at 1100-1400 K for oxide ceramic substrate. EFFECT: improved thermal stability of resistive layer obtained, stable in operation and showing low surface resistivity. 2 dwg, 2 tbl
Authors
Dates
1994-01-15—Published
1990-03-06—Filed