PROCESS OF MANUFACTURE OF PRINTED CIRCUIT BOARD Russian patent published in 1994 - IPC

FIELD: electronics. SUBSTANCE: such density of laser radiation which provides for evaporation temperature of material of substrate in focal region is chosen for selective treatment of thermally sensitive layer by laser radiation to manufacture catalytically active centers in workstock for subsequent chemical copper plating. Jet of gas directed along normal to surface of substrate acts on vapor mixture of products of thermochemical reaction of activator and evaporation of material in the form of flame. As creation of active centers of metallization on surface of substrate is conducted by evaporation then increased dose of activator is applied to substrata, i. e. layer of activator should be comparable in thickness to thickness of layer of material evaporated from substrate. As a result of such action of laser radiation rough microfurrows with active centers embedded into them are formed over pattern of circuit which decreases requirements to preliminary preparation of surface and increases adhesion of conductor deposited chemically. EFFECT: facilitated manufacture, improved quality of printed circuit boards. 3 cl