FIELD: process of manufacture of printed-circuit boards. SUBSTANCE: the method is based on inclusion of surface sections, positioned between the catalytically active centers formed at activator laser thermolysis, in the mechanism of adhesion of the substrate to chemically deposited connection strip. This inclusion is effected by pressing of printed-circuit boards by a flat punch heated to the softening temperature of the substrate material on the side of the conductive pattern of the flat surface at a pressure providing the required flow of the substrate softened material. EFFECT: facilitated procedure.
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