FIELD: microelectronics. SUBSTANCE: stoichiometric layers of silicon oxide are produced by plasmachemical oxidation of hexamethyldisilasan with nitrogen monoxide injected into reactor behind zone of discharge inductor under partial pressures of (0,5-2,0)·10-2 and (3,0-5,0)·10-2 accordingly with substrate temperature 200-300 C in atmosphere of helium which is injected into reactor through zone of HF discharge under partial pressure (1,5-3,0)·10-2 and with power of HF discharge 80-100 W. EFFECT: improved efficiency of process. 1 dwg, 1 tbl
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Authors
Dates
1994-05-30—Published
1992-03-19—Filed