FIELD: manufacturing semiconductor devices. SUBSTANCE: method involves the steps of: applying organo-circonium composition onto a substrate, exposing to ultraviolet radiation at a temperature of 100-200 degrees C for 15-60 min, subjecting to heat treatment by exposing to non-coherent light of intensity sufficient to cause the heating of the substrate at a rate of 60-150 degrees C/sec up to 500-900 degrees C. EFFECT: enhanced efficiency. 1 tbl
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