FIELD: printed circuit board production. SUBSTANCE: method of producing lacquer-foil polyimide material involves the steps of: applying polyimide acid lacquer onto a metallic foil, drying, subjecting to tensioning force which is effected by winding the polyimide coating together washer polymeric apron having thickness of 100-400 mcm or with metallic tape having thickness of 80-250 mcm and dehydrocyclization of the coating. EFFECT: improved quality.
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