FIELD: microelectronics. SUBSTANCE: substrate stack is formed with pattern of conductors and pads having holes for interconnections. Pads are placed above hole for interconnections and are provided with at least one gap between outer contour of pad and inner wall of hole in substrate. After pads are run over with tin, substrates are stacked and pressed while interconnection holes are filled up with conductor material; substrate is made of material nonwetted by solder. EFFECT: facilitated procedure. 8 cl, 3 dwg
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