CONTACT ASSEMBLY Russian patent published in 1999 - IPC

FIELD: non-split joints for microelectronic and semiconductor devices. SUBSTANCE: contact assembly has at least two metal-coated contacts coupled with current-carrying tracks placed on switching-layer surfaces on insulating substrate, joined together, and interconnected electrically and mechanically by means of electricity conducting binder. Contact assembly is, essentially, joint between metal-coated contact pad coupled with current-carrying tracks on surface of lower switching layer and mating contact made in the form of metal-coated hole in insulating layer. EFFECT: enlarged functional capabilities of contact assembly. 23 cl, 6 dwg