METHOD FOR MANUFACTURING MULTILAYER INTEGRATED CIRCUITS AND MULTILAYER PRINTED- CIRCUIT BOARDS USING POLYMERIC SUBSTRATE Russian patent published in 2002 - IPC

FIELD: radio electronics; hybrid integrated circuits and multilayer printed-circuit boards. SUBSTANCE: contact pads produced on bilateral boards of multilayer PCB stack are symmetrical relative to contact pads of adjacent bilateral boards which provides for reliable vertical contact. Contact pads are made in the form of interrupted metal area; pairs of contact pads are not on same axis in at least sequential levels of connections; at least one of contact pads being connected in each pair is run over with easily melting metal and not with solder thereby eliminating vertical through solder pile passing in stack via coaxial holes in films; stacks of bilateral film boards are assembled simultaneously with any stiff base. Insulating gaskets between pairs of bilateral boards may be dispensed with. EFFECT: enhanced reliability of multilayer printed-circuit boards. 6 cl, 1 dwg, 2 ex