FIELD: electronics, production of thin-film resistors.
SUBSTANCE: process includes successive deposition of resistive and conducting layers on dielectric substrate and formation of pattern of circuit. Substrate is deformed in direction corresponding to proper sign of required increment of resistance after setting of substrate in case to tune resistance of resistor to required value. Internal space of case provides for free motion during formation of substrate as result of pressure on dielectric substrate created in opposite directions mechanically.
EFFECT: potential for adjustment of resistance of thin- film resistor in process of its operation in mix of electronic circuit and for possibility of two-way adjustment.
2 dwg
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