THERMALLY STABLE THIN-FILM INTEGRATED CIRCUIT Russian patent published in 2002 - IPC

FIELD: electronic engineering; thin-film microelectronics for various industries. SUBSTANCE: integrated circuit has package, package leads, integrated resistor mounted on insulating substrate which is joined with package by means of adhesive. Integrated resistor is, essentially, nodal network of N separate thin-film resistors whose resistance depends on nodal network structure and on resistances in cells of this structure; desired value of integrated resistor is attained in the course of discrete adjustment by structuring the nodal network basing on data stored in the course of measurements and calculated mathematical relations. Integrated-resistor nodal network has separate resistor chips produced by dividing insulating substrate of integrated circuit into K parts by cutting it in longitudinal and transversal directions; separate resistor chips are electrically interconnected by wire jumpers welded or soldered so that in nodal resistor network they are mechanically interconnected by means of soft adhesive joint. Maximal number of chips depends on parameter K and on mechanical design of standard package; precision of integrated resistor is finally corrected by adjusting this or that resistor chip of nodal network. Thin-film resistor structure configuration of each rectangular chip is of serpentine form with maximal possible resistance in meanders of resistive strips whose direction is parallel to smallest side of chip. EFFECT: enhanced stability and thermal coefficient of resistance. 3 dwg