THIN-FILM HEAT-STABLE INTEGRATED CIRCUIT Russian patent published in 1999 - IPC

Abstract RU 2129741 C1

FIELD: electronic engineering; precision sets of resistors for various industries. SUBSTANCE: integrated circuit has package, package leads, insulating substrate connected to package through adhesive joint, junction net of thin-film resistors whose components are made of N separate resistors and its total resistance depends on junction net structure and on cell resistance of this structure. EFFECT: improved stability of electric characteristics and enlarged functional capabilities due to adequate design and connection of resistors. 2 dwg

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RU 2 129 741 C1

Authors

Lugin A.N.

Vlasov G.S.

Litvinov A.N.

Dates

1999-04-27Published

1996-04-15Filed