METHOD FOR MANUFACTURING OF THICK-FILM RESISTORS Russian patent published in 1997 - IPC

FIELD: electric engineering. SUBSTANCE: method involves subsequent deposition of first conductor layer on insulation substrate, deposition of resistive layer and second conductor layer in order to achieve capacitor structure. Layers are dried and burned in air. Conducting layers are made from conducting paste which includes reducing agent (boron, aluminum), or material which is decomposed during burning so that such reducing agent is generated (nickel boride). Paste for resistive layer include glass powder and organic binder. EFFECT: increased functional capabilities. 1 tbl