FIELD: manufacture of microelectronic devices. SUBSTANCE: resistive polymer film is locally irradiated by fluxes of radiation or particles with subsequent etching. In the process of manufacture film is heated up to temperature within the range of highly elastic deformation of polymer between temperatures of vitrification and flow, and then it is stretched. Stretched film is cooled down to temperature less than vitrification temperature and exposed to local irradiation by fluxes of radiation or particles. This done, stretching is stopped by heating irradiated film up to temperature which exceeds vitrification temperature but is not higher than temperature of flow. Film is then cooled down and subjected to chemical treatment in order to etch pattern. Operations of chemical treatment and repeated heating can be performed in reverse order or simultaneously, and after repeated heating, due to the "form memory" effect, polymer film returns to initial non-stretched state to which sizes of etched patterns and thickness of lines correspond. EFFECT: improved manufacturing process. 3 cl
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Authors
Dates
1997-09-27—Published
1992-09-28—Filed