INTEGRATED CIRCUIT ON SEMICONDUCTOR SUBSTRATE Russian patent published in 1997 - IPC

FIELD: electronic engineering. SUBSTANCE: integrated circuit power leads are arranged so that length of connecting conductors is minimized. In addition, power leads are placed one after another so that RMS inductance of connecting conductors coupled with them is reduced. Output leads are arranged immediately after power leads so as to reduce inductive stray effects. Control leads follow output ones. As a result, properly protected core of standard leads can be used, for example, for integrating circuits of storage devices having different configurations. EFFECT: enlarged functional capabilities. 13 cl, 2 dwg