FIELD: information technologies.
SUBSTANCE: electric connection by method of a flip-chip between an acoustic element (250) and ASIC (260) - a specialised integral circuit, comprises the following components: a ledge (210), having the first and second electrically connecting surfaces (214, 215), the first connecting surface is larger than the second connecting surface, where the first connecting surface (214) of the ledge (210) is electrically connected to an acoustic element (250); and a site (220), comprising the first and second electrically connecting surfaces (224, 228), where the first connecting surface (224) of the site (220) is electrically connected to ASIC (260), and the second electrically connecting surface (228) of the site (220) is electrically connected and is smaller in size than the second electrically connecting surface (215) of the ledge (210), at the same time ASIC is configured with the one comprising electronic circuits arranged under the specified site.
EFFECT: reduced pitch while using regular technologies of ASIC manufacturing.
15 cl, 3 dwg
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