FIELD: semiconductor engineering; coating plates with photoresist or other materials. SUBSTANCE: for shaping photoresist layer, some portion of solution is deposited on plate rotating at speed of 5000-7000 rpm and after entire surface of plate is covered with solution, uniform layer is formed within 10-15 s while varying plate rotation speed obeying law ω = A/t,, where t is time since beginning of deposition; ω is angular velocity of plate rotation; A is experimental constant depending on physical properties of photoresist, viscosity, and the like. EFFECT: improved uniformity of coat. 2 dwg , 1 tbl
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR PRODUCING PHOTORESIST COATINGS | 1998 |
|
RU2136077C1 |
GEAR TO DEPOSIT PHOTORESIST ON PLATE | 1993 |
|
RU2093921C1 |
METHOD AND DEVICE FOR PRODUCING PHOTORESIST COATING | 1999 |
|
RU2158987C1 |
METHOD TESTING THICKNESS OF FILM IN PROCESS OF ITS DEPOSITION | 1999 |
|
RU2157509C1 |
DEVICE FOR APPLICATION OF COATS ON SUBSTRATES | 0 |
|
SU1827691A1 |
METHOD OF PRODUCING MESA-STRUCTURES | 0 |
|
SU1050476A1 |
PROCESS OF PHOTOLITHOGRAPHY | 1996 |
|
RU2096935C1 |
MODE OF FABRICATION OF SEMICONDUCTOR SHF LIMITER DIODES BY GROUP METHOD | 2011 |
|
RU2452057C1 |
CONTROL METHOD FOR AN ELECTROMECHANICAL DRIVE SYSTEM | 2016 |
|
RU2670848C9 |
0 |
|
SU438972A1 |
Authors
Dates
1997-10-27—Published
1994-09-19—Filed