SOLDER FOR SOLDERING OF ARTICLES AND METHOD OF THEIR SOLDERING Russian patent published in 1998 - IPC

FIELD: soldering of articles, mainly, mass production with use of solder from copper in the form of copper wire. SUBSTANCE: solder in made in the form of wire (rings) 0.5-1.5 mm in diameter coated with layer of manganese 5-10 mcm thick that amounts to 0.5-1.0% of copper content. Soldering is carried out in furnace, in argon medium at temperature of 1050-1090 C. EFFECT: absence of defects in soldered joints, simplified and wasteless process of solder preparation, increased adaptability to manufacture. 2 cl, 1 tbl